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 BSM 50 GD120DN2E3226
IGBT Power Module
* Power module * 3-phase full-bridge * Including fast free-wheel diodes * Package with insulated metal base plate * E3226: long terminals, limited current per terminal
Type BSM 50 GD120DN2E3226 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage
VCE
IC
Package ECONOPACK 2
Ordering Code C67070-A2514-A67
1200V 50A
Symbol
Values 1200 1200
Unit V
VCE VCGR VGE IC
RGE = 20 k
Gate-emitter voltage DC collector current
20 A 50 45
TC = 25 C TC = 80 C
Pulsed collector current, tp = 1 ms
ICpuls
100 90
TC = 25 C TC = 80 C
Power dissipation per IGBT
Ptot
350
W + 150 -55 ... + 150 0.35 0.7 2500 16 11 F 55 / 150 / 56 Jan-10-1997 sec Vac mm K/W C
TC = 25 C
Chip temperature Storage temperature Thermal resistance, chip case Diode thermal resistance, chip case Insulation test voltage, t = 1min. Creepage distance Clearance DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
Semiconductor Group
Tj Tstg RthJC RthJCD Vis
1
BSM 50 GD120DN2E3226
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage Values typ. max. Unit
VGE(th)
4.5 5.5 2.5 3.1 0.8 4 6.5 3 3.7
V
VGE = VCE, IC = 2 mA
Collector-emitter saturation voltage
VCE(sat)
-
VGE = 15 V, IC = 50 A, Tj = 25 C VGE = 15 V, IC = 50 A, Tj = 125 C
Zero gate voltage collector current
ICES
1 -
mA
VCE = 1200 V, VGE = 0 V, Tj = 25 C VCE = 1200 V, VGE = 0 V, Tj = 125 C
Gate-emitter leakage current
IGES
200
nA
VGE = 20 V, VCE = 0 V
AC Characteristics Transconductance
gfs
23 3300 500 220 -
S pF -
VCE = 20 V, IC = 50 A
Input capacitance
Ciss Coss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Output capacitance
VCE = 25 V, VGE = 0 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Semiconductor Group
2
Jan-10-1997
BSM 50 GD120DN2E3226
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 C Turn-on delay time Values typ. max. Unit
td(on)
44 100
ns
VCC = 600 V, VGE = 15 V, IC = 50 A RGon = 22
Rise time
tr
56 100
VCC = 600 V, VGE = 15 V, IC = 50 A RGon = 22
Turn-off delay time
td(off)
380 500
VCC = 600 V, VGE = -15 V, IC = 50 A RGoff = 22
Fall time
tf
70 100
VCC = 600 V, VGE = -15 V, IC = 50 A RGoff = 22
Free-Wheel Diode Diode forward voltage
VF
2.3 1.8 2.8 -
V
IF = 50 A, VGE = 0 V, Tj = 25 C IF = 50 A, VGE = 0 V, Tj = 125 C
Reverse recovery time
trr
0.2 -
s
IF = 50 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s, Tj = 125 C
Reverse recovery charge
Qrr
C
IF = 50 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s Tj = 25 C Tj = 125 C
2.8 8 -
Semiconductor Group
3
Jan-10-1997
BSM 50 GD120DN2E3226
Power dissipation Ptot = (TC) parameter: Tj 150 C
360 W
Safe operating area IC = (VCE) parameter: D = 0, TC = 25C , Tj 150 C
10 3
A
Ptot
280 240 200 160 120
IC
10 2
tp = 29.0s
100 s
10 1
1 ms
10 0 80 40 0 0 10 -1 0 10 DC
1 2
10 ms
20
40
60
80
100
120
C
160
10
10
10
3
V
TC
VCE
Collector current
IC = f (TC)
parameter: VGE 15 V, Tj 150 C
Transient thermal impedance Zth JC = (tp) parameter: D = tp / T
10 0
IGBT
K/W
ZthJC
10 -1
10 -2 D = 0.50 0.20 0.10 10 -3 single pulse 0.05 0.02 0.01
10 -4 -5 10
10
-4
10
-3
10
-2
10
-1
s 10
0
tp
Semiconductor Group
4
Jan-10-1997
BSM 50 GD120DN2E3226
Typ. output characteristics
Typ. output characteristics
IC = f (VCE)
parameter: tp = 80 s, Tj = 25 C
90 A
IC = f (VCE)
parameter: tp = 80 s, Tj = 125 C
90 A 17V 15V 13V 11V 9V 7V
IC
70 60 50 40 30 20 10 0 0
IC
70 60 50 40 30 20 10 0 0
17V 15V 13V 11V 9V 7V
1
2
3
V
5
1
2
3
V
5
VCE
VCE
Typ. transfer characteristics
IC = f (VGE)
parameter: tp = 80 s, VCE = 20 V
90 A
IC
70 60 50 40 30 20 10 0 0
2
4
6
8
10
V 14 VGE
Semiconductor Group
5
Jan-10-1997
BSM 50 GD120DN2E3226
Typ. gate charge VGE = (QGate) parameter: IC puls = 50 A
20 V
Typ. capacitances
C = f (VCE)
parameter: VGE = 0 V, f = 1 MHz
10 2
nF
VGE
16 14 12 10 8
C
600 V
800 V
10 1
Ciss
10 0 6 4 2 0 0 10 -1 0 Coss Crss
40
80
120
160
200
240
280
340
5
10
15
20
25
30
QGate
V 40 VCE
Reverse biased safe operating area
Short circuit safe operating area
ICpuls = f(VCE) , Tj = 150C parameter: VGE = 15 V
2.5
ICsc = f(VCE) , Tj = 150C parameter: VGE = 15 V, tSC 10 s, L < 50 nH
12
ICpuls/IC
ICsc/IC
8 1.5 6 1.0 4
0.5 2
0.0 0 200 400 600 800 1000 1200 V 1600 VCE
0 0 200 400 600 800 1000 1200 V 1600 VCE
Semiconductor Group
6
Jan-10-1997
BSM 50 GD120DN2E3226
Typ. switching time
Typ. switching time
I = f (IC) , inductive load , Tj = 125C
par.: VCE = 600 V, VGE = 15 V, RG = 22
10 3
t = f (RG) , inductive load , Tj = 125C
par.: VCE = 600 V, VGE = 15 V, IC = 50 A
10 4
ns t ns tdoff t 10 3 tdoff
10 2
tr tr tdon 10 2 tf
tf tdon
10 1 0
20
40
60
80
A
120
10 1 0
20
40
60
80
IC
120
RG
Typ. switching losses
Typ. switching losses
E = f (IC) , inductive load , Tj = 125C
par.: VCE = 600 V, VGE = 15 V, RG = 22
25
E = f (RG) , inductive load , Tj = 125C
par.: VCE = 600V, VGE = 15 V, IC = 50 A
25
Eon E mWs E mWs Eon 15 15
10
Eoff
10 Eoff
5
5
0 0
20
40
60
80
A
120
0 0
20
40
60
80
IC
120
RG
Semiconductor Group
7
Jan-10-1997
BSM 50 GD120DN2E3226
Forward characteristics of fast recovery reverse diode IF = f(VF) parameter: Tj
90 A
Transient thermal impedance Zth JC = (tp) parameter: D = tp / T
10 0
Diode
K/W
IF
70 60 50 40 30
ZthJC
10 -1
Tj=125C
Tj=25C
10 -2 D = 0.50 0.20 0.10 10 -3 single pulse 0.05 0.02 0.01
20 10 0 0.0 10 -4 -5 10
0.5
1.0
1.5
2.0
V
3.0
10
-4
10
-3
10
-2
10
-1
s 10
0
VF
tp
Semiconductor Group
8
Jan-10-1997
BSM 50 GD120DN2E3226
Circuit Diagram
Package Outlines Dimensions in mm Weight: 180 g
Semiconductor Group
9
Jan-10-1997


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